高電圧半導体モジュール樹脂ヶースの汚損耐電圧特性の研究

URI http://repository.tsuyama-ct.ac.jp/metadata/5
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Title
高電圧半導体モジュール樹脂ヶースの汚損耐電圧特性の研究
Title Alternative
Study on dielectric characteristics of Contaminated Resin Case For High-voltage Semiconductor Module
Author
著者 田辺 茂
著者(別表記) Tanabe Shigeru
著者 小川 友也
著者(別表記) Ogawa Tomoya
著者 井上 和哉
著者(別表記) Inoue Kazuya
Abstract

The purpose of this study is to clarify insulation characteristics of contaminated resin case for high-voltage
semiconductor modules under dc voltage. Also this study plans to develop a novel design of resin case which has higher insulation performance. 3 kinds of model are prepared for the test made of PBT and PPS resin. The tests were carried out under the conditions of 50℃ and 80%RH. We found out that the design now used for 1700V IGBT maintain enough dielectric strength for 30 years under 0.06mg/cm(2) contamination. We also evaluated new case models and they showed little improvement

Subject
540 Electrical engineering
Keyword
creepage insulation
contaminated surface
semiconductor module
resin case
Publish Date
2008
Publication Title
津山工業高等専門学校紀要
Publication Title Alternative
Bulletin of Tsuyama National Collge of Technology
Volume
49
Start Page
29
End Page
34
ISSN
0287-7066
NCID
AN00149351
Publisher
津山工業高等専門学校
Contents Type
Departmental Bulletin Paper
language
Japanese
File Version
publisher